Poly-Flex Circuits Limited
7Patents
0Active
7Granted
28Portfolio score
Filing activity: Nov 14, 1989 → Sep 30, 2002
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5531020A | Method of making subsurface electronic circuits | Emerging Cross-Sectional Technologies | 119 | Expired |
| US5631191A | Method for connecting a die to electrically conductive traces on a flexible lead-frame | Electricity | 68 | Expired |
| US5326636A | Assembly using electrically conductive cement | Emerging Cross-Sectional Technologies | 50 | Expired |
| US5180523A | Electrically conductive cement containing agglomerate, flake and powder metal fillers | Emerging Cross-Sectional Technologies | 36 | Expired |
| US5183593A | Electrically conductive cement | Electricity | 27 | Expired |
| US5455394A | Flexible printed polymer lead frame | General | 6 | Revoked |
| US7642126B2 | Method of manufacturing circuits | Electricity | 1 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.