Structure and method for providing a lead frame with enhanced solder wetting leads
US5531860A · kind A · utility
13Cited by
8References
6Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 4, 1995 |
| Grant date | Jul 2, 1996 |
| Priority date | — |
| Expiry date | May 4, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49121
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A lead frame for used in a surface mount package is provided leads which are each notched at the tip of the lead to reduce the exposed area of based metal and to increase the area on which solder wetting can take place when bonded to conductive traces of a printed circuit board. In one embodiment, the thickness of the tip of the lead is reduced to further the area over which soldering wetting takes place. In that embodiment, the exposed base metal area is reduced by 85 per cent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.