QPL Limited
8Patents
4Active
8Granted
35Portfolio score
Filing activity: Aug 10, 1990 → Oct 6, 2011 · 1 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5781879A | Semantic analysis and modification methodology | Physics | 107 | Expired |
| US5121707A | Apparatus for coating materials in a vacuum chamber | Chemistry; Metallurgy | 17 | Expired |
| US5531860A | Structure and method for providing a lead frame with enhanced solder wetting leads | Emerging Cross-Sectional Technologies | 13 | Expired |
| US6822319B1 | Leadframe for enhanced downbond registration during automatic wire bond process | Electricity | 3 | Expired |
| US7504712B2 | Electronic device with selective nickel palladium gold plated leadframe and method of making the same | Electricity | 2 | Active |
| US8338924B2 | Substrate for integrated circuit package with selective exposure of bonding compound and method of making thereof | Electricity | 1 | Active |
| US8513786B2 | Pre-bonded substrate for integrated circuit package and method of making the same | Emerging Cross-Sectional Technologies | 1 | Active |
| US8569110B2 | Pre-bonded substrate for integrated circuit package and method of making the same | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.