Method of making electroconductive adhesive particles for Z-axis application
US5531942A · kind A · utility
17Cited by
31References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 16, 1994 |
| Grant date | Jul 2, 1996 |
| Priority date | — |
| Expiry date | Jun 16, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0338
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Electroconductive resin adhesive particles are incorporated in a dielectric-resin-adhesive-containing carrier to form a Z-axis adhesive. Particles are preferably produced by printing techniques or by in-fluid forming techniques, the latter being particularly suited for the formation of substantially spherical particle shapes. The particles also have use as discrete adhesive members.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.