Fry's Metals, Inc.
49Patents
12Active
49Granted
42Portfolio score
Filing activity: May 9, 1977 → Oct 18, 2012 · 9 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6228678A | Flip chip with integrated mask and underfill | Electricity | 68 | Expired |
| US6228681A | Flip chip having integral mask and underfill providing two-stage bump formation | Electricity | 43 | Expired |
| US7749883B2 | Electroformed stencils for solar cell front side metallization | Emerging Cross-Sectional Technologies | 41 | Active |
| US5637176A | Methods for producing ordered Z-axis adhesive materials, materials so produced, and devices, incorporating such materials | Emerging Cross-Sectional Technologies | 37 | Expired |
| US6265776A | Flip chip with integrated flux and underfill | Electricity | 34 | Expired |
| US5571340A | Rosin-free, low VOC, no-clean soldering flux and method using the same | Performing Operations; Transporting | 26 | Expired |
| US6653741B2 | Thermal interface material and heat sink configuration | Electricity | 24 | Expired |
| US5297721A | No-clean soldering flux and method using the same | Performing Operations; Transporting | 24 | Expired |
| US5789068A | Preformed solder parts coated with parylene in a thickness effective to exhibit predetermined interference colors | Emerging Cross-Sectional Technologies | 21 | Expired |
| US6506448B1 | Method of protective coating BGA solder alloy spheres | Electricity | 20 | Expired |
| US7187083B2 | Thermal interface material and solder preforms | Electricity | 17 | Expired |
| US5531942A | Method of making electroconductive adhesive particles for Z-axis application | Electricity | 17 | Expired |
| US6938227B2 | System and method for modifying electronic design data | Emerging Cross-Sectional Technologies | 16 | Expired |
| US6345718B1 | Method and apparatus for immobilizing solder spheres | Emerging Cross-Sectional Technologies | 11 | Expired |
| US7213739B2 | Underfill fluxing curative | Emerging Cross-Sectional Technologies | 9 | Expired |
| US6331201A | Bismuth coating protection for copper | Electricity | 8 | Expired |
| US6599372B2 | Soldering flux | Emerging Cross-Sectional Technologies | 8 | Expired |
| US6183871A | Sealing glass paste for cathode ray tubes | Electricity | 7 | Expired |
| US6635101B2 | Rapid surface cooling of solder droplets by flash evaporation | Performing Operations; Transporting | 7 | Expired |
| US7968008B2 | Particles and inks and films using them | Emerging Cross-Sectional Technologies | 7 | Active |
| US7413771B2 | Coating solder metal particles with a charge director medium | Emerging Cross-Sectional Technologies | 6 | Expired |
| US7585549B2 | Method of applying a pattern of particles to a substrate | Electricity | 6 | Active |
| US4676296A | Apparatus for casting metal alloys having low melting points | Performing Operations; Transporting | 6 | Expired |
| US6524398B2 | Low-residue, low-solder-ball flux | Performing Operations; Transporting | 6 | Expired |
| US7247683B2 | Low voiding no flow fluxing underfill for electronic devices | Electricity | 5 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.