Method and apparatus for enhanced contact and via lithography
US5532090A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Mar 1, 1995 |
| Grant date | Jul 2, 1996 |
| Priority date | — |
| Expiry date | Mar 1, 2015 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70466
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An enhanced method and apparatus for forming openings in a photosensitive layer. Using a standard microlithographic printer such as stepper or scan and step system, an unpatterned photosensitive layer is exposed to a first mask having an opening pattern with dimensions within tight (for a given technology generation) process tolerances. Next, prior to development, the photosensitive layer is exposed to a second mask having a grid of clear spaces, surrounding the opening pattern. The combined exposure to the first and second mask forms a latent image of a reduced dimension opening. By the use of two exposures, with the exposure dose for each designed such that intensity profile is easily controllable in the presence of uncontrollable equipment imperfections and process variations, a reduced dimension opening can be formed in a highly manufacturable process with opening sizes smaller than that achievable through conventional lithographic techniques.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.