Semiconductor device inspection system involving superimposition of image data for detecting flaws in the semiconductor device
US5532607A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 18, 1994 |
| Grant date | Jul 2, 1996 |
| Priority date | — |
| Expiry date | Jul 18, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/12
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device inspection system having an improved measurement accuracy and in operability. A semiconductor device is observed from the bottom surface side. First, image data obtained upon image pickup under infrared illumination is converted into first left-to-right-reversed image data corresponding to a left-to-right-reversed image and the first reversed image data is stored. Then an image is obtained under no illumination from very weak light emitted from an abnormal portion when a bias is applied to the semiconductor device. Image data of the very weak light image is then converted into second left-to-right-reversed image data corresponding to a left-to-right-reversed image. The first and second left-to-right-reversed image data are superimposedly added to each other and a superimposed image is displayed with the abnormal portion being superimposed on a chip pattern as seen from the top surface of the semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.