Parylene deposition apparatus including a tapered deposition chamber and dual vacuum outlet pumping arrangement
US5534068A · kind A · utility
54Cited by
12References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 27, 1995 |
| Grant date | Jul 9, 1996 |
| Priority date | — |
| Expiry date | Oct 27, 2015 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G2261/3424
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A parylene deposition apparatus is provided for the quick and efficient deposition of Parylene AF4 onto silicon wafers in the production of semiconductor chips. The apparatus includes a frusto-conical shaped deposition chamber which minimizes deposition chamber volume and maximizes flow of vapor over the surface of the wafer, and a vacuum by-pass assembly wherein a high-conductance vacuum outlet is utilized to quickly reduce pressure in the vacuum chamber system and a low-conductance vacuum manifold outlet is utilized to maintain vacuum flow during the deposition procedure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.