Parylene deposition apparatus including a heated and cooled support platen and an electrostatic clamping device
US5536322A · kind A · utility
27Cited by
4References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 27, 1995 |
| Grant date | Jul 16, 1996 |
| Priority date | — |
| Expiry date | Oct 27, 2015 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G2261/3424
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Chemical vapor deposition apparatus is provided for the quick and efficient deposition of Parylene AF4 onto silicon wafers in the production of semiconductor chips. The apparatus includes a heated and cooled platen for supporting the wafer in the deposition chamber and for controlling the temperature of the wafer during deposition procedures, and further includes an electrostatic clamping device for clamping the wafer in intimate thermal contact with the platen.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.