High frequency microelectronic circuit enclosure
US5541565A · kind A · utility
8Cited by
23References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 22, 1995 |
| Grant date | Jul 30, 1996 |
| Priority date | — |
| Expiry date | May 22, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An enclosure assembly for a high frequency integrated circuit. The enclosure assembly includes a plurality of lead terminals that are part of a lead frame. The lead terminals are connected to electrical ports of the circuit within the enclosure to connect the circuit to other integrated circuits and/or to a printed circuit board. A portion of the lead terminals outside of the enclosure has a specially shaped flared region that establishes the characteristic impedance of the circuit on the lead lines outside of the enclosure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.