John E. Dowsing, III
4Patents
2h-index
6Co-inventors
33Inventor score
Filing activity: Nov 12, 1993 → Mar 23, 1999
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5541565A | High frequency microelectronic circuit enclosure | Emerging Cross-Sectional Technologies | 8 | Expired |
| US5402003A | Low dielectric constant interconnect for multichip modules | Electricity | 6 | Expired |
| US5956840A | Low cost hermetic sealed microwave module packaging | Emerging Cross-Sectional Technologies | 1 | Expired |
| US6028007A | Low cost hermetic sealed microwave module packaging | Emerging Cross-Sectional Technologies | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.