Apparatus to minimize stiction in micromachined structures
US5542295A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 1, 1994 |
| Grant date | Aug 6, 1996 |
| Priority date | — |
| Expiry date | Dec 1, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S73/01
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An electro-mechanical micromachined structure uses bumpers to prevent contact between structures at different potentials. A beam is connected to one or more anchors by flexible suspensions, which permit the beam to move along a predetermined axis relative to one or more plates. The suspension includes at least one bumper positioned so that the bumper will contact another part of the suspension before the beam contacts the plates. The bumper is made from the same material as the suspension, during the same processing step. The bumper is positioned to take advantage of shrinkage or expansion of the beam during processing which forces the bumper closer to its contact point then would otherwise be possible.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.