Stabilization of conductive adhesive by metallurgical bonding
US5542602A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 30, 1994 |
| Grant date | Aug 6, 1996 |
| Priority date | — |
| Expiry date | Dec 30, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0425
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A metallurgical bond which may be substituted for a soldering process forms an alloy of a metal with a metal coating applied to at least one of the surfaces to be so bonded by a transient liquid phase (TLP) reaction at a low temperature. Mechanically robust bonding of noble metals for electrical connections which are resistively stable through repeated thermal cycling can be performed at particularly low temperatures using coating materials of indium, tin or lead. Isotropically or anisotropically conductive connections can be formed by applying a polymer adhesive containing conductive particles to at least one of the surfaces to be bonded and a compressional force developed between surface by curing of the polymer adhesive at temperatures lower than the melting point of a eutectic alloy of the chosen metal system before the TLP process is allowed to proceed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.