Photodefinable dielectric composition useful in the manufacture of printed circuits
US5545510A · kind A · utility
3Cited by
15References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 28, 1995 |
| Grant date | Aug 13, 1996 |
| Priority date | — |
| Expiry date | Mar 28, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0209
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A composition and process useful in fabricating circuitry packages with permanent resists is proposed. The proposed composition comprises a carboxy functional resin, an acrylate oligomer, an epoxy functional resin, a butadiene nitrile resin, and a photoinitiator.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.