Optocoupler package and method for making
US5545893A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 23, 1994 |
| Grant date | Aug 13, 1996 |
| Priority date | — |
| Expiry date | Dec 23, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48247
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An optocoupler package (40) has two pre-molded thermoplastic halves (42, 54); one containing the emitter (16) and the other containing the detector (18). The detector half (54) has a well (56) where the detector (54) is located. The well (56) is filled with silicon die coat gel (24). The emitter half (42) has a similar well (48) containing the emitter. Surrounding the well (48) of the emitter half is a protruding wall (50) with relief vents (52). The wall (50) is configured to fit into the perimeter of the well (56) of the detector package half (54). When the package (40) is assembled, the protruding wall (50) of the emitter half (42) is inserted into the well (56) of the detector package half (54), thereby displacing the gel (24) so as to completely fill the internal chamber (66) and spill into the relief vents (52).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.