Three-dimensional compact array of electronic circuitry
US5546274A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Mar 10, 1995 |
| Grant date | Aug 13, 1996 |
| Priority date | — |
| Expiry date | Mar 10, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A three-dimensional compact array of electronic circuitry includes a plurality of stacked modular compact arrays of electronic circuitry. Each modular compact array of electronic circuitry includes a substrate-less multi-chip module supporting a number of integrated circuits and interconnect which electrically connects the integrated circuits. Each modular compact array of electronic circuitry further includes an integrated heat exchanger and stacking connector supporting the substrate-less multi-chip module. The integrated heat exchanger and stacking connector includes a transverse connector region including a plurality of connector vias for connection to the interconnect of the substrate-less multi-chip module, and a transverse flow region including channels for circulating a coolant to remove heat from the substrate-less multi-chip module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.