Method of applying flex tape protective coating onto a flex product
US5546655A · kind A · utility
16Cited by
6References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 25, 1994 |
| Grant date | Aug 20, 1996 |
| Priority date | — |
| Expiry date | Oct 25, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A flex or TAB product suitable for chip carrier applications wherein the flex reliability problems caused by copper dendrite growth and lead bending during power and thermal cycling are reduced by application of special coatings to lead areas of the flex tape.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.