Inventor · Rio de Janeiro, BR

Claudius Feger

52Patents
15h-index
90Co-inventors
87Inventor score

Filing activity: Jul 13, 1988 → Sep 21, 2019

Most-cited inventions

PatentTitleAreaCited byStatus
US7402442B2 Physically highly secure multi-chip assembly Emerging Cross-Sectional Technologies 224 Expired
US6929900B2 Tamper-responding encapsulated enclosure having flexible protective mesh structure Electricity 118 Expired
US6686539B2 Tamper-responding encapsulated enclosure having flexible protective mesh structure Electricity 89 Expired
US6672759B2 Method for accounting for clamp expansion in a coefficient of thermal expansion measurement Physics 88 Expired
US7768005B2 Physically highly secure multi-chip assembly Emerging Cross-Sectional Technologies 70 Active
US5619357A Flat panel display containing black matrix polymer Physics 52 Expired
US6746053B1 System for preventing parallel marketing of retail items Emerging Cross-Sectional Technologies 44 Expired
US6181554A Portable computer riser for enhanced cooling Physics 28 Expired
US6817538B2 Method and system for preventing parallel marketing of wholesale and retail items Emerging Cross-Sectional Technologies 21 Expired
US6924171B2 Bilayer wafer-level underfill Electricity 19 Expired
US6423566B1 Moisture and ion barrier for protection of devices and interconnect structures Electricity 19 Expired
US4846929A Wet etching of thermally or chemically cured polyimide Electricity 17 Expired
US5546655A Method of applying flex tape protective coating onto a flex product Emerging Cross-Sectional Technologies 16 Expired
US6130472A Moisture and ion barrier for protection of devices and interconnect structures Electricity 16 Expired
US10392555B2 Nanoparticle design for enhanced oil recovery Chemistry; Metallurgy 15 Active
US5288842A Morphological composite materials formed from different precursors Emerging Cross-Sectional Technologies 13 Expired
US7452568B2 Centrifugal method for filing high aspect ratio blind micro vias with powdered materials for circuit formation Electricity 12 Active
US5382637A Solid state chain extension polymerization between Lewis acid oligomers and deblocked Lewis bases Physics 12 Expired
US8938627B2 Multilayer securing structure and method thereof for the protection of cryptographic keys and code Emerging Cross-Sectional Technologies 12 Active
US8820612B2 Injection molded solder process for forming solder bumps on substrates Electricity 11 Active
US5360946A Flex tape protective coating Emerging Cross-Sectional Technologies 10 Expired
US6919420B2 Acid-cleavable acetal and ketal based epoxy oligomers Emerging Cross-Sectional Technologies 8 Expired
US7523852B2 Solder interconnect structure and method using injection molded solder Emerging Cross-Sectional Technologies 7 Expired
US7442049B2 Electrical connecting device and method of forming same Electricity 6 Expired
US6414377B1 Low k dielectric materials with inherent copper ion migration barrier Electricity 5 Expired

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.