Apparatus and method for analyzing foreign matter on semiconductor wafers and for controlling the manufacturing process of semiconductor devices
US5550372A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Oct 16, 1995 |
| Grant date | Aug 27, 1996 |
| Priority date | — |
| Expiry date | Oct 16, 2015 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N23/2252
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A device for analyzing foreign matter on semiconductor wafers is provided, which is capable of analyzing a great deal of foreign matter rapidly without requiring the higher level decision capabilities of a skilled analyst. The device for analyzing foreign matter on semiconductor wafers includes a scanning electron microscope (SEM) which obtains the composition ratios of each element of a plurality of foreign matter adhered to semiconductor wafers. A foreign matter plotting section is provided to obtain the distribution of the composition ratios of the plurality of foreign matter on the basis of a result obtained by the SEM. A foreign matter classifying process section classifies the plurality of foreign matter on the basis of the distribution. A foreign matter identifying process section compares the foreign matter classification result with data stored in advance in a foreign matter data base, thereby identifying the foreign matter type.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.