Hermetic packaging with optical
US5550398A · kind A · utility
57Cited by
2References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 12, 1995 |
| Grant date | Aug 27, 1996 |
| Priority date | — |
| Expiry date | Jun 12, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F77/50
Abstract
The invention is to a semiconductor package and method of making in which an optical glass window (23) is secured to a housing (20) at a low temperature. The optical glass (23) is etched and a metal layer (26) is formed on the etched surface. The metal layer is sealed to a metal frame (21) and the frame is sealed to a housing (20), or the deposited metal layer (26) is sealed directly to the housing (20).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.