Thermal process module for substrate coat/develop system
US5553994A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 11, 1994 |
| Grant date | Sep 10, 1996 |
| Priority date | — |
| Expiry date | Oct 11, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/136
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a photolithography system, baking and cooling of semiconductor substrates is done in a thermal process module that uses a unique mechanism including pulleys to route vacuum tubing to a transfer arm. Specifically, the mechanism includes a pair of pulleys and a vacuum tube wrapped around the pulleys. The vacuum tube has a movable portion connected to the transfer arm which is reciprocable between the pair of pulleys. The vacuum tube also has a stationary portion that is connected to the movable portion to form an endless loop. The stationary portion of the vacuum tube is rigidly connected to a vacuum supply line in the housing of the thermal process module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.