Orbital motion chemical-mechanical polishing apparatus and method of fabrication
US5554064A · kind A · utility
101Cited by
6References
46Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 6, 1993 |
| Grant date | Sep 10, 1996 |
| Priority date | — |
| Expiry date | Aug 6, 2013 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B57/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method and apparatus for polishing a thin film formed on a semiconductor substrate. A table covered with a polishing pad is orbited about an axis. Slurry is fed through a plurality of spaced-apart holes formed through the polishing pad to uniformly distribute slurry across the pad surface during polishing. A substrate is pressed face down against the orbiting pad's surface and rotated to facilitate, along with the slurry, the polishing of the thin film formed on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.