Overmolded semiconductor package
US5557150A · kind A · utility
68Cited by
4References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 27, 1995 |
| Grant date | Sep 17, 1996 |
| Priority date | — |
| Expiry date | Apr 27, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D62/117
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A technique for providing partially and fully overmolded semiconductor packages is described which prevents delamination (detachment) of the molding compound from the substrate by allowing the molding compound to flow through holes in the substrate and forming it into rivet-like anchors on the opposite side of the substrate. Various shapes of rivet-like anchors are described. Different embodiments provide for the formation of molded standoffs and locating pins integral to the anchor structures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.