Method and apparatus for uniform polishing of a substrate
US5558563A · kind A · utility
64Cited by
3References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 23, 1995 |
| Grant date | Sep 24, 1996 |
| Priority date | — |
| Expiry date | Feb 23, 2015 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/042
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method and apparatus for improved control of polishing in chemical-mechanical polishing operations is provided. The polishing is controlled by applying different amounts of pressure to the surface of a substrate during polishing. A polishing pad which includes raised portions is used to apply the varying amounts of pressure. In addition, the position, size and height of the raised portions is used to affect the amount of pressure applied.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.