Wafer polishing machine with fluid bearings
US5558568A · kind A · utility
153Cited by
29References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 2, 1994 |
| Grant date | Sep 24, 1996 |
| Priority date | — |
| Expiry date | Nov 2, 2014 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/12
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A semi-conductor wafer polishing machine having a polishing pad assembly and a wafer holder includes a support positioned adjacent the polishing pad assembly. The support includes multiple fluid bearings that support the polishing pad assembly on the support. These fluid bearings are arranged concentrically to provide concentric regions of support for the polishing pad assembly, and each fluid bearing is coupled to a respective source of pressurized fluid at a respective pressure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.