Electronic package with improved electrical performance
US5559306A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Oct 11, 1995 |
| Grant date | Sep 24, 1996 |
| Priority date | — |
| Expiry date | Oct 11, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/858
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic package having improved electrical properties in which a plastic Quad Flat Pack is provided with upper and lower metallic plates encased in the plastic body and overlapping at least a portion of the length of the encased portion of the leads whereby the self and mutual inductance of the package is reduced. A ceramic Quad Flat Pack is provided with metal plates attached to the mating surfaces of the ceramic cover component and the ceramic base component so that at least a portion of the enclosed portion of the leads which are electrically connected to the electronic component inside the components is overlapped on the top and bottom by the metallic plates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.