Surface mount peripheral leaded and ball grid array package
US5563446A · kind A · utility
27Cited by
8References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 25, 1994 |
| Grant date | Oct 8, 1996 |
| Priority date | — |
| Expiry date | Jan 25, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A surface mounted integrated circuit die package includes a group of peripheral leads extending laterally outwardly from the perimeter of the package and also includes an array of solder balls on the bottom of the package. The arrangement provides for a greater number of input/output connections to a die package by utilizing both peripheral leads and a ball grid array without requiring increases in package size or a reduction in the width of electrically conductive interconnections.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.