Semiconductor device manufacturing method wherein the substrate is interferically aligned by measuring the rotation of the original
US5563708A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jun 1, 1994 |
| Grant date | Oct 8, 1996 |
| Priority date | — |
| Expiry date | Jun 1, 2014 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F9/70
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
In a step-and-repeat type semiconductor device manufacturing exposure apparatus, a pattern of a reticle can be transferred to a wafer with no chip rotation or no array error. For this sake, the direction of rotation of an X axis or a Y axis of the reticle about a Z axis is detected, and an X-Y-.theta. stage is rotationally moved about the Z axis in accordance with the detected value and by using a measurement output of a laser interferometer. Also, after rotational movement of the X-Y-.theta. stage about the Z axis, the X-Y-.theta. stage is moved while using a measurement output of the laser interferometer, to print the pattern of the reticle onto different zones of the wafer sequentially.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.