Base substrate of multichip module and method for inspecting the same
US5565767A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 5, 1993 |
| Grant date | Oct 15, 1996 |
| Priority date | — |
| Expiry date | Feb 5, 2013 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2884
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A plurality of bare semiconductor IC chips are mounted on a base substrate. The base substrate and IC chips are sealed in a package to constitute a multichip module. Diodes are disposed on the base substrate so that an end of each diode is connected to a terminal for connecting each IC chip with said base substrate and the other end thereof is connected to a prescribed voltage. As a result, it is possible to inspect the base substrate by contacting probes only with a connecting pad between the base substrate and a package, to reduce the number of pins of a probe card, to produce a cheap probe card and to reduce a rate of imperfect contact between the probe card and an inspecting pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.