Electrochemical metal removal technique for planarization of surfaces
US5567300A · kind A · utility
255Cited by
17References
22Claims
0Family size
Assignee
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Key dates
| Filing date | Sep 2, 1994 |
| Grant date | Oct 22, 1996 |
| Priority date | — |
| Expiry date | Sep 2, 2014 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25F3/16
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A high speed electrochemical metal removal technique provides for planarization of multilayer copper interconnection in thin film modules. The process uses a neutral salt solution, is compatible with the plating process and has minimum safety and waste disposal problems. The process offers tremendous cost advantages over previously employed micromilling techniques for planarization.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.