Madhav Datta
49Patents
22h-index
73Co-inventors
88Inventor score
Filing activity: Sep 7, 1990 → Jan 14, 2015
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5567300A | Electrochemical metal removal technique for planarization of surfaces | Chemistry; Metallurgy | 255 | Expired |
| US5217586A | Electrochemical tool for uniform metal removal during electropolishing | Chemistry; Metallurgy | 164 | Expired |
| US5937320A | Barrier layers for electroplated SnPb eutectic solder joints | Electricity | 161 | Expired |
| US6853076B2 | Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same | Electricity | 132 | Expired |
| US6103096A | Apparatus and method for the electrochemical etching of a wafer | Electricity | 120 | Expired |
| US6224690A | Flip-Chip interconnections using lead-free solders | Electricity | 99 | Expired |
| US5543032A | Electroetching method and apparatus | Electricity | 98 | Expired |
| US5558957A | Method for making a thin flexible primary battery for microelectronics applications | Emerging Cross-Sectional Technologies | 79 | Expired |
| US5268072A | Etching processes for avoiding edge stress in semiconductor chip solder bumps | Electricity | 74 | Expired |
| US7836597B2 | Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system | Emerging Cross-Sectional Technologies | 70 | Active |
| US5462638A | Selective etching of TiW for C4 fabrication | Electricity | 55 | Expired |
| US5486282A | Electroetching process for seed layer removal in electrochemical fabrication of wafers | Electricity | 47 | Expired |
| US5066370A | Apparatus, electrochemical process, and electrolyte for microfinishing stainless steel print bands | Chemistry; Metallurgy | 46 | Expired |
| US5284554A | Electrochemical micromachining tool and process for through-mask patterning of thin metallic films supported by non-conducting or poorly conducting surfaces | Electricity | 33 | Expired |
| US5567304A | Elimination of island formation and contact resistance problems during electroetching of blanket or patterned thin metallic layers on insulating substrate | Electricity | 32 | Expired |
| US6977224B2 | Method of electroless introduction of interconnect structures | Electricity | 29 | Expired |
| US6696758B2 | Interconnect structures and a method of electroless introduction of interconnect structures | Electricity | 28 | Expired |
| US6917106B2 | Selective ball-limiting metallurgy etching processes for fabrication of electroplated tin bumps | Electricity | 27 | Expired |
| US5800726A | Selective chemical etching in microelectronics fabrication | Chemistry; Metallurgy | 25 | Expired |
| US5865984A | Electrochemical etching apparatus and method for spirally etching a workpiece | Chemistry; Metallurgy | 24 | Expired |
| US5989751A | High energy density, flexible lithium primary batteries | Electricity | 23 | Expired |
| US6030728A | High performance lithium polymer electrolyte battery | Electricity | 23 | Expired |
| US5105537A | Method for making a detachable electrical contact | Emerging Cross-Sectional Technologies | 21 | Expired |
| US5536388A | Vertical electroetch tool nozzle and method | Chemistry; Metallurgy | 20 | Expired |
| US5796168A | Metallic interconnect pad, and integrated circuit structure using same, with reduced undercut | Electricity | 19 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.