Method and workpiece for connecting a thin layer to a monolithic electronic module's surface and associated module packaging
US5567654A · kind A · utility
107Cited by
18References
56Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 28, 1994 |
| Grant date | Oct 22, 1996 |
| Priority date | — |
| Expiry date | Sep 28, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A fabrication method and resultant monolithic electronic module having a separately formed thin-film layer attached to a side surface. The fabrication method includes providing an electronic module composed of stacked integrated circuit chips. A thin-film layer is separately formed on a temporary support which is used to attach the thin-film layer to the electronic module. The disclosed techniques may also be used for attaching an interposer, which may include active circuity, to an electronic module. Specific details of the fabrication method, resulting multichip packages, and various thin-film structures are set forth.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.