Built-in self test indicator for an integrated circuit package
US5570035A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 31, 1995 |
| Grant date | Oct 29, 1996 |
| Priority date | — |
| Expiry date | Jan 31, 2015 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F11/321
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Apparatus for providing a direct indication of the failure of an electronic ircuit including a built-in self test circuit which performs an initial test on the electronic circuit and having a visual indicator coupled thereto which becomes activated when the self test circuit senses a failure of the electronic circuit upon power being supplied thereto or during operation. The electronic circuit with the built-in test feature consists of an integrated circuit chip or a multi-chip module encapsulated in a package with the indicator means visible therethrough. The indicator consists either of a light emitting diode or fusible material which changes its appearance and becomes visible through the package upon being activated by the built-in self test circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.