Wafer holder for semiconductor wafer polishing machine
US5571044A · kind A · utility
24Cited by
13References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 11, 1994 |
| Grant date | Nov 5, 1996 |
| Priority date | — |
| Expiry date | Oct 11, 2014 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/30
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A semi-conductor wafer polishing machine having at least one polishing pad assembly and at least one wafer holder positioned to hold a semi-conductor wafer against the polishing pad assembly includes a joint having two axes of rotation intersecting at a center of rotation. A wafer chuck is supported on the joint adjacent the periphery of the chuck to provide higher material removal rates at the center of the wafer than the periphery of the wafer during polishing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.