Method for cleaning and drying a semiconductor wafer
US5571337A · kind A · utility
92Cited by
18References
44Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 9, 1995 |
| Grant date | Nov 5, 1996 |
| Priority date | — |
| Expiry date | May 9, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for drying articles with flat surfaces such as a semiconductor wafer. The method includes steps of immersing a semiconductor wafer in a liquid such as water, and displacing the liquid with a gaseous mixture. The liquid is displaced adjacent to a face of the wafer as measured from the face. A step of pulsing drying fluid directed at wafer edges is also included. The method dries wafers without the use of any harmful organic solvents and the like, and also dries wafers without substantial movement.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.