Method of fabrication of endcap chip with conductive, monolithic L-connect for multichip stack
US5571754A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 9, 1995 |
| Grant date | Nov 5, 1996 |
| Priority date | — |
| Expiry date | Nov 9, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19041
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An endcap chip is provided for a multichip stack comprising multiple integrated circuit chips laminated together. The endcap chip has a substrate with an upper surface and a edge surface, which extends in a plane orthogonal to the upper surface. At least one conductive, monolithic L-connect is disposed over the substrate such that a first leg extends at least partially over the upper surface of the substrate and a second leg extends at least partially over the edge surface of the substrate. When the endcap chip is located at the end of the multichip stack, the at least one conductive, monolithic L-connect electrically connects metal on an end face of the stack to metal on a side face of the stack. A fabrication process is set forth for producing the endcap chip with lithographically defined dimensions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.