Integrated circuit packages with heat dissipation for high current load
US5572070A · kind A · utility
41Cited by
2References
23Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 6, 1995 |
| Grant date | Nov 5, 1996 |
| Priority date | — |
| Expiry date | Feb 6, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package capable of carrying high wattage and efficiently dissipating heat generated by the die is fabricated from a die, printed wiring board and metal lid, with a beta-stageable resin which is preapplied to the lid and which contains a thermally conductive filler material. With the lid in place over the die and substrate board, the package is heated to cause the resin to flow and establish contact with the die. Further heating causes curing of the resin and a permanent thermal bridge between the die and the lid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.