RJR Polymers, Inc.
9Patents
3Active
9Granted
34Portfolio score
Filing activity: Mar 30, 1990 → Oct 13, 2010
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5572070A | Integrated circuit packages with heat dissipation for high current load | Emerging Cross-Sectional Technologies | 41 | Expired |
| US5706579A | Method of assembling integrated circuit package | Emerging Cross-Sectional Technologies | 39 | Expired |
| US5056296A | Iso-thermal seal process for electronic devices | Emerging Cross-Sectional Technologies | 34 | Expired |
| US6511866B1 | Use of diverse materials in air-cavity packaging of electronic devices | Electricity | 33 | Expired |
| US6214152A | Lead frame moisture barrier for molded plastic electronic packages | Electricity | 13 | Expired |
| US5816158A | Inverted stamping process | Electricity | 12 | Expired |
| US8759965B2 | Modular low stress package technology | Electricity | 2 | Active |
| US8639373B2 | Modular low stress package technology | Electricity | 1 | Active |
| US8560104B2 | Modular low stress package technology | Electricity | 1 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.