Heat transfer module incorporating liquid metal squeezed from a compliant body
US5572404A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 21, 1995 |
| Grant date | Nov 5, 1996 |
| Priority date | — |
| Expiry date | Sep 21, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S165/907
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat transfer module, comprises: a heat generating unit and a heat receiving unit which are separated by a gap; a compliant body, having microscopic voids therethrough, which is compressed into the gap; and a liquid metal alloy that is absorbed in the microscopic voids in the compliant body. Further, the heat transfer module also includes a seal ring in the gap which surrounds the compliant body and which is spaced apart from the compliant body; and, the compliant body is intentionally compressed so much that a portion of the liquid metal alloy is squeezed from the compliant body into the space between the compliant body and the seal ring. Squeezing liquid metal alloy from the compliant body lowers the thermal resistance between the heat generating unit and the heat receiving unit by increasing the area through which heat is transferred and by increasing the thermal conductivity through the compliant body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.