Laser ablation mask and method of fabrication
US5573875A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 8, 1995 |
| Grant date | Nov 12, 1996 |
| Priority date | — |
| Expiry date | Dec 8, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24355
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A laser ablation mask and a method of fabrication therefor. The mask has a pattern of clear areas and scattering areas. The scattering areas are covered with randomly formed facets. The facets act as scattering centers. Areas clear of facets transmit laser energy. Scattering areas refract laser energy. Laser energy directed at the mask, will pass through the clear mask areas to selectively ablate an organic layer placed opposite the mask. However, laser energy is scattered when striking and passing through the scattering areas such that insufficient laser energy passes directly through the mask to reach the organic layer for ablation to occur. The mask is formed by depositing and patterning a metal mask layer on a quartz plate. The patterned mask layer protects intended clear areas. Scattering areas are formed in unprotected plate areas by subjecting the plate to a polymethacrylic acid/bifluoride solution.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.