Polymeric polishing pad containing hollow polymeric microelements
US5578362A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 12, 1994 |
| Grant date | Nov 26, 1996 |
| Priority date | — |
| Expiry date | Jul 12, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31591
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention relates to an article of manufacture or polishing pad for altering a surface of a workpiece, such as polishing or planarizing a semiconductor device. The article includes a polymeric matrix impregnated with a plurality of polymeric microelements, each polymeric microelement having a void space therein. The article has a work surface and a subsurface proximate to the work surface. When the article is in contact with a working environment, polymeric microelements at the work surface of the article are less rigid than polymeric elements embedded in the subsurface. As the work surface of the article is abraded during use, the work surface of the pad may be continuously regenerated. In alternative preferred embodiments, the work surface may further include a minitexture and/or a macrotexture. Preferably, the minitexture is formed by fractal patterning at least a portion of the work surface. The present invention also includes methods for decreasing the effective rigidity of polymeric microelements at the work surface of the article, regenerating the work surface of the article and planarizing a surface of a semiconductor device utilizing the article.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.