Aluminum-palladium alloy for initiation of electroless plating
US5580668A · kind A · utility
23Cited by
18References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 12, 1995 |
| Grant date | Dec 3, 1996 |
| Priority date | — |
| Expiry date | Jan 12, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12993
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Thin layers of aluminum (13) and palladium (12) are deposited and annealed to produce aluminum-palladium alloy (14). The surface of the alloy (14) is exposed and treated with an aluminum etchant to produce a catalytic surface (15). The catalytic surface is used for electroless plating of nickel, providing excellent plating uniformity and adhesion, as well as a reduced plating induction time. Several variants of the basic method are possible.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.