Orbital chemical mechanical polishing apparatus and method
US5582534A · kind A · utility
75Cited by
50References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 27, 1993 |
| Grant date | Dec 10, 1996 |
| Priority date | — |
| Expiry date | Dec 27, 2013 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/16
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A process for polishing substrates includes a carrier which receives a substrate and positions it against a slowly rotating polishing pad. The carrier orbits the pad on the rotating pad, at a speed significantly greater than the rotational speed of the polishing pad, to ensure that the movement of the polishing pad is a very small increment of the cumulative motion between the pad and substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.