Method of fabricating chemical-mechanical polishing pad providing polishing uniformity
US5584146A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 8, 1996 |
| Grant date | Dec 17, 1996 |
| Priority date | — |
| Expiry date | Feb 8, 2016 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/26
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
In accordance with the present invention, a polishing pad useful for polishing a semiconductor-comprising substrate is disclosed. The polishing pad is constructed to include conduits which pass through at least a portion of and preferably through the entire thickness of the polishing pad. The conduits, preferably tubulars, are constructed from a first material which is different from a second material used as a support matrix. The conduits are positioned within the support matrix such that the longitudinal centerline of the conduit forms an angle ranging from about 60.degree. to about 120.degree. with the working surface of the polishing pad. One preferred method of fabrication the polishing pad is pultrusion, where the tubulars are pulled through a resin bath to apply a coating of resin and then through a series of dies in which the resin is cured to provide a support matrix around the tubulars. The composite of tubulars and surrounding matrix, which Would typically be cylindrical in form with the tubulars perpendicular to the end faces of the cylinder, is then sliced into polishing pads of the desired thickness. A second method of forming the polishing pad is by casting or inject…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.