Object handling devices
US5584647A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 19, 1993 |
| Grant date | Dec 17, 1996 |
| Priority date | — |
| Expiry date | Jan 19, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T74/20207
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
An object handling device successively transfers objects such as semiconductor wafers. The object handling device includes first and second collapsible arm units having hands for holding objects, a first drive shaft for selectively extending and contracting the first arm unit, a second drive shaft for selectively extending and contracting the second arm unit, a third drive shaft for turning the first and second arm units while keeping the first and second arm units in a relative positional relationship, the first, second, and third drive shafts being disposed coaxially with each other, and an actuator mechanism for angularly moving the first, second, and third drive shafts about their own axes independently of each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.