Process and apparatus for forming and testing semiconductor package leads
US5585281A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 3, 1995 |
| Grant date | Dec 17, 1996 |
| Priority date | — |
| Expiry date | Feb 3, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49004
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of forming leads and providing a final test of a semiconductor package including an electronic circuit therein, the package having unformed leads. A forming and testing station is provided including a support for receiving the package, and dies movably positioned adjacent the support for contacting and forming the leads with test equipment connected to the dies. The semiconductor package is positioned on the support, and the leads of the package are contacted with the dies to connect the test equipment to the leads for testing the electronic circuitry in the package and to form the leads with this contacting step as the final manufacturing step.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.