Inventor · Phoenix, AZ, US

Darrell D. Truhitte

25Patents
4h-index
9Co-inventors
56Inventor score

Filing activity: Feb 3, 1995 → Aug 4, 2020

Most-cited inventions

PatentTitleAreaCited byStatus
USD510728S1 Semiconductor device package General 34 Expired
USD504874S1 Semiconductor device package General 32 Expired
US5585281A Process and apparatus for forming and testing semiconductor package leads Emerging Cross-Sectional Technologies 22 Expired
US10199311B2 Leadless semiconductor packages, leadframes therefor, and methods of making Electricity 5 Active
US9559007B1 Plasma etch singulated semiconductor packages and related methods Electricity 4 Active
US9899349B2 Semiconductor packages and related methods Electricity 3 Active
US10304798B2 Semiconductor packages with leadframes and related methods Electricity 3 Active
US6852574B1 Method of forming a leadframe for a semiconductor package Electricity 2 Expired
US10269609B2 Wafer level flat no-lead semiconductor packages and methods of manufacture Electricity 2 Active
US10103072B2 Damaging components with defective electrical couplings Electricity 1 Active
US10163766B2 Methods of forming leadless semiconductor packages with plated leadframes and wettable flanks Electricity 1 Active
US10756006B2 Leadless semiconductor packages, leadframes therefor, and methods of making Electricity 1 Active
US11049843B2 Semiconductor packages Electricity 0 Active
US9892952B2 Wafer level flat no-lead semiconductor packages and methods of manufacture Electricity 0 Active
US11037903B2 Plasma etch singulated semiconductor packages and related methods Electricity 0 Active
US10770333B2 Wafer level flat no-lead semiconductor packages and methods of manufacture Electricity 0 Active
US10399756B2 Carrier tape with standoff units Performing Operations; Transporting 0 Active
US10770332B2 Wafer level flat no-lead semiconductor packages and methods of manufacture Electricity 0 Active
US12424522B2 Leadless semiconductor packages, leadframes therefor, and methods of making Electricity 0 Active
US10093468B2 Carrier tape with standoff units Performing Operations; Transporting 0 Active
US11145581B2 Methods of forming leadless semiconductor packages with plated leadframes and wettable flanks Electricity 0 Active
US10529632B2 Damaging components with defective electrical couplings Electricity 0 Active
US9659876B1 Wafer-scale marking systems and related methods Electricity 0 Active
US8987054B2 Semiconductor devices and methods of making the same Emerging Cross-Sectional Technologies 0 Active
US10707111B2 Wafer level flat no-lead semiconductor packages and methods of manufacture Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.