Process and apparatus for contamination-free processing of semiconductor parts
US5587095A · kind A · utility
0Cited by
16References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 22, 1995 |
| Grant date | Dec 24, 1996 |
| Priority date | — |
| Expiry date | Aug 22, 2015 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC30B25/12
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
This invention relates generally to a process and apparatus for contamination-free processing of semiconductor parts. More specifically, this invention relates to a process and apparatus for contamination-free processing of semiconductor parts in an oven or a furnace. This invention also relates to a process and apparatus for contamination-free processing of semiconductor parts in a furnace, such as a belt type furnace that sequentially stops the belt at the vicinity of at least one heating or cooling unit to heat or cool the part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.