Photosensitive resin composition and a process for forming a patterned polyimide film using the same
US5587275A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jul 5, 1995 |
| Grant date | Dec 24, 1996 |
| Priority date | — |
| Expiry date | Jul 5, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4676
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The composition comprises (A) a specified polyimide precursor and (B) at least one member selected from the group consisting of a sensitizer, a photopolymerization initiator and a combination thereof. The above method comprises coating the solution of the above photosensitive resin composition on a substrate, followed by drying to form a coating film; exposing the coating film to light, followed by developing with an aqueous alkaline solution to form a patterned film; and heat-curing the patterned film. The composition has little ionic impurities mixed therein during the preparation of the composition; is excellent in storage stability in the state of a solution; can be developed with an aqueous alkaline solution, which does not cause the problems such as a problem to health and a problem to the treatment of waste liquids, within a short time; and exhibits a good sensitivity even when formed a thick film, thereby readily providing a patterned resinous film. Further, the cured product obtained by heat-curing the patterned film has a superior heat resistance and excellent electrical and mechanical properties, which can be suitably used as a protective film for use in electronic parts…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.