Passive gas substrate thermal conditioning apparatus and method
US5588827A · kind A · utility
75Cited by
31References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 7, 1995 |
| Grant date | Dec 31, 1996 |
| Priority date | — |
| Expiry date | Jun 7, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67103
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A substrate thermal conditioning apparatus with a chamber, a plate located in the chamber and a gas supply. The plate has a top heat transfer surface with grooves therealong. A substrate is placed on standoffs of the heat transfer surface and gas is pumped into the chamber. The plate is either heated or cooled to change the temperature of the substrate. Heat is transferred between the substrate and the plate primarily by gas conduction heating. Because of the grooves in the plate, the gas can be very quickly and uniformly distributed and evacuated between the substrate and the heat transfer surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.